of the primary activities at MEi is determining how and why materials,
components and systems fail. Hardware failures are costly and frustrating.
We can help you solve these problems.
Causes of Failures
• Material Defects
• Environment Effects
• Improper Processing
• Poor Design
• Improper Material
• Extraordinary Loading
• Ductile Overload
• Brittle Overload
• Chemical Exposure
• Thermal Fatigue
• Corrosion Fatigue
• Stress Corrosion Cracking
Environmental Stress Cracking
• Stress Rupture
will verify the material composition and processing to determine if
defects in material or improper processing contributed to the failure.
will determine if the failure is an isolated incident, or has the
potential to become a recurring problem.
discussing results with you, we will work with you to establish and
implement a corrective action plan.
our strong background in engineering design and principles, we can
fully understand the operation of the failed component, gathering
information from you that may provide clues about the cause of failure.
Then using the scanning electron microscope, energy dispersive spectroscopy,
optical microscopy and metallography, we will determine the mode of
failure, the cause of failure, and pinpoint the exact location of